Beijing Grish Hitech Co., Ltd.
China |
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| Products Catalog: Polishing fabric |
(Product Photo) |
| Specification: | Precise polishing fabric is produced using the most advanced ultra precise coating and resin binding technique and coats the polishing powder on the surface of high strength and wearable spinning materials. The minute socket on the surface of base material is favorable dross off chute and polishing efficiency can be prompted highly. By using high strength base material and adopting the advanced resin binding technique, unexpected scratch and environment pollution can be prevented because of little shed of grinding aid. Apertures in base material can absorb more grinding medium, such as water, then the work piece surface can seldom be scratched which may cause by high temperature. Soft and elastic base material can adhere to the work piece better and prompt the quality and efficiency of polishing. Technical Parameter Mineral Aluminum oxide( AO) silica carbide( SC) cerium oxide( CO) silicon oxide( SO) purity 99.5%
Base material Terylene and filarrent material can be customized with high strength and softness
Particle size/ µ m 2000 8000 10000 400~ 50000 can be customized LA-920 laser granularity instrument
Thickness/ µ m 80
120 different according to base material Clock gauge
Roughness/ µ m 4.0 different according to base material TR200 toughness instrument
Weight g/ m2 100 different according to base material
Color white red
Common specification 152mm× 9m 200mm× 9m can be customized
Features Ï High polishing rate and quality Ï Soft and elastic raw fabric avoids unexpected scratch Ï Even uniformity and adhesiveness of coating and polishing material avoid dross off. Application Ï Can be used for precise electronic components’ polishing and clearing on surface Ï Precise optical glass polishing and clearing on surface, such as optical lens and LCD board Ï Polishing for glue removal, scratch and clearness of LCD board Ï Polishing for various metal rollers Ï Polishing and clearing of mobile phone shell Ï Polishing for semiconductor wafer, such as gallium arsenide and indium phosphide |
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| Company Contact |
| Name: |
Ms. nancy wang [Marketing] |
| E-mail: |
business.nancy@yahoo.com |
| Homepage: |
http://www.bjgrish.com |
| Instant Messaging |
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| Phone Number: |
+86 134 88703600 |
| Address: |
Rm401,Block C,Zhongguancun Development Building,No.12 Shangdi information Rd.,Haidian District,Beijing,China
Beijing 100085, Beijing
China |
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